Asicland Marks First Anniversary of ‘Taiwan R&D Center’…“Leap Forward as a Semiconductor Design Hub
▶ Finalizing Development Environment for Sub-3nm Advanced Process and 3D Packaging through Close Collaboration with TSMC
▶ Securing Global Business Execution Capabilities by Maximizing Two-Track Synergy between Korea Headquarters and Taiwan R&D Center
▲A view of asicland Taiwan R&D center
Asicland (KOSDAQ: 445090), a leading provider of ASIC (Application-Specific Integrated Circuit) design solutions, announced on the 8th that its R&D Center in Hsinchu, Taiwan, has reached its first anniversary.
Over the past year, the Taiwan R&D Center has established a state-of-the-art advanced process design environment, executed TSMC chiplet projects, organized a dedicated CoWoS® team, and secured senior engineers with more than 20 years of experience—solidifying its growth as a “global semiconductor hub.”
Located in Hsinchu, the heart of the semiconductor industry, the center is surrounded by TSMC headquarters along with IP, packaging, and testing companies, making it an optimal site for semiconductor research and development. From this location, Asicland is able to capture global semiconductor trends more rapidly, generate diverse business opportunities, and expand its footprint in the industry.
The company expects to accelerate its technological advancement through collaborative projects with TSMC, particularly in CoWoS-R® and chiplet-based design. Given the limited number of fabless firms in Korea working on 3nm and 5nm processes, the expertise accumulated in Taiwan is anticipated to serve as a critical asset.
Andy, Head of Asicland Taiwan R&D Center, said the center is focusing on research into 2nm, 3nm, and 5nm nodes as well as 2.5D and 3D packaging technologies. He added that this year the goal is to internalize 3nm design flows and CoWoS chiplet design capabilities so they can be applied to projects beginning in 2026.
Sean Lee, Head of Global Strategy at Asicland, said the Taiwan R&D Center serves both as a strategic outpost that leverages its geographic advantage and as a base for agile responses to global market changes. He noted that Asicland will continue to expand into major markets—including the U.S., Europe, and the Middle East—by building on synergies with its Korean headquarters.
Asicland Marks First Anniversary of ‘Taiwan R&D Center’…“Leap Forward as a Semiconductor Design Hub
▶ Finalizing Development Environment for Sub-3nm Advanced Process and 3D Packaging through Close Collaboration with TSMC
▶ Securing Global Business Execution Capabilities by Maximizing Two-Track Synergy between Korea Headquarters and Taiwan R&D Center
▲A view of asicland Taiwan R&D center
Asicland (KOSDAQ: 445090), a leading provider of ASIC (Application-Specific Integrated Circuit) design solutions, announced on the 8th that its R&D Center in Hsinchu, Taiwan, has reached its first anniversary.
Over the past year, the Taiwan R&D Center has established a state-of-the-art advanced process design environment, executed TSMC chiplet projects, organized a dedicated CoWoS® team, and secured senior engineers with more than 20 years of experience—solidifying its growth as a “global semiconductor hub.”
Located in Hsinchu, the heart of the semiconductor industry, the center is surrounded by TSMC headquarters along with IP, packaging, and testing companies, making it an optimal site for semiconductor research and development. From this location, Asicland is able to capture global semiconductor trends more rapidly, generate diverse business opportunities, and expand its footprint in the industry.
The company expects to accelerate its technological advancement through collaborative projects with TSMC, particularly in CoWoS-R® and chiplet-based design. Given the limited number of fabless firms in Korea working on 3nm and 5nm processes, the expertise accumulated in Taiwan is anticipated to serve as a critical asset.
Andy, Head of Asicland Taiwan R&D Center, said the center is focusing on research into 2nm, 3nm, and 5nm nodes as well as 2.5D and 3D packaging technologies. He added that this year the goal is to internalize 3nm design flows and CoWoS chiplet design capabilities so they can be applied to projects beginning in 2026.
Sean Lee, Head of Global Strategy at Asicland, said the Taiwan R&D Center serves both as a strategic outpost that leverages its geographic advantage and as a base for agile responses to global market changes. He noted that Asicland will continue to expand into major markets—including the U.S., Europe, and the Middle East—by building on synergies with its Korean headquarters.