ASICLAND Signs Automotive Chip Design Supply Agreement with Leading U.S. IDM Company
▶ Strengthening automotive semiconductor design capabilities through collaboration with a global semiconductor client
▶ Expanding the foundation for entry into the global automotive semiconductor market through specialized automotive design
[2025-06-11] ASICLAND has signed a supply agreement with a leading U.S. integrated device manufacturer (IDM) to jointly target the global automotive semiconductor market.
ASICLAND (KOSDAQ: 445090, CEO Jongmin Lee), a leader in application-specific integrated circuit (ASIC) design solutions, announced on the 11th that it has signed a contract with a prominent U.S.-based IDM for the supply of automotive semiconductor design services.
This agreement presents a key opportunity for ASICLAND to further strengthen its design capabilities in the automotive semiconductor sector through collaboration with a global industry player. With the rapid growth of the automotive semiconductor market, driven by electric vehicles and autonomous driving technologies, the partnership is expected to enhance ASICLAND’s position in the industry.
The U.S. semiconductor company involved is an IDM providing essential chip designs and power management solutions for automotive electronics systems, with active operations across various industrial sectors. Through this collaboration, ASICLAND will expand its technological foundation and expertise in automotive chip design.
With this agreement, ASICLAND aims to increase its market share in automotive electronics, enhancing its capabilities in key areas such as power management and sensor network optimization. The company also plans to broaden its global client base, delivering optimized semiconductor design solutions for the automotive market as it positions itself as a global design solution leader.
CEO Jongmin Lee of ASICLAND stated, “This agreement marks a significant milestone that recognizes ASICLAND’s technological capabilities in the global automotive semiconductor market. We will continue to strengthen our competitiveness through global partnerships and technological innovation.”
Meanwhile, ASICLAND is accelerating efforts to enter global markets by establishing an advanced R&D center in Hsinchu, Taiwan. The company is actively securing cutting-edge design technologies for 3nm and 5nm process nodes as well as CoWos (Chip-on-Wafer-on-Substrate) packaging technologies.
ASICLAND Signs Automotive Chip Design Supply Agreement with Leading U.S. IDM Company
▶ Strengthening automotive semiconductor design capabilities through collaboration with a global semiconductor client
▶ Expanding the foundation for entry into the global automotive semiconductor market through specialized automotive design
[2025-06-11] ASICLAND has signed a supply agreement with a leading U.S. integrated device manufacturer (IDM) to jointly target the global automotive semiconductor market.
ASICLAND (KOSDAQ: 445090, CEO Jongmin Lee), a leader in application-specific integrated circuit (ASIC) design solutions, announced on the 11th that it has signed a contract with a prominent U.S.-based IDM for the supply of automotive semiconductor design services.
This agreement presents a key opportunity for ASICLAND to further strengthen its design capabilities in the automotive semiconductor sector through collaboration with a global industry player. With the rapid growth of the automotive semiconductor market, driven by electric vehicles and autonomous driving technologies, the partnership is expected to enhance ASICLAND’s position in the industry.
The U.S. semiconductor company involved is an IDM providing essential chip designs and power management solutions for automotive electronics systems, with active operations across various industrial sectors. Through this collaboration, ASICLAND will expand its technological foundation and expertise in automotive chip design.
With this agreement, ASICLAND aims to increase its market share in automotive electronics, enhancing its capabilities in key areas such as power management and sensor network optimization. The company also plans to broaden its global client base, delivering optimized semiconductor design solutions for the automotive market as it positions itself as a global design solution leader.
CEO Jongmin Lee of ASICLAND stated, “This agreement marks a significant milestone that recognizes ASICLAND’s technological capabilities in the global automotive semiconductor market. We will continue to strengthen our competitiveness through global partnerships and technological innovation.”
Meanwhile, ASICLAND is accelerating efforts to enter global markets by establishing an advanced R&D center in Hsinchu, Taiwan. The company is actively securing cutting-edge design technologies for 3nm and 5nm process nodes as well as CoWos (Chip-on-Wafer-on-Substrate) packaging technologies.